Electronic module

ABSTRACT

An electronic module comprises a sealing part 90, a rear surface-exposed conductor 10, 20, 30, a rear surface-unexposed conductor 40, 50 and a second connector 70 for electrically connecting an electronic element 15, 25 to the rear surface-unexposed conductor 40, 50. The rear surface-unexposed conductor 40, 50 is positioned on a front surface side compared with the rear surface-exposed part 12, 22, 32. The second connection tip part 72 is positioned on a rear surface side compared with the second connection base part 71. A distance H in a thickness direction between a rear surface side end part of the second connection base part 71 and a rear surface side end part of the second connection tip part 72 is larger than a width W of the second connection tip part 72 of the second connector 70.

TECHNICAL FIELD

The present invention relates to an electronic module having a rearsurface-exposed part whose rear surface is exposed from a sealing part.

BACKGROUND ART

In conventional electronic modules, control electrodes (gate electrodes)and lead terminals (lead frames) of high-side and low-side electronicelements (MOSFETs) are soldered with connectors (gate clips) (forexample, refer to JP 2002-100716 A and JP 2009-238859 A).

In such an electronic module, since a control electrode (gate electrode)of an electronic element is smaller than the other input/outputelectrodes (source electrode and drain electrode), it is difficult toconnect a control electrode and a connector, and it is necessary tostably connect one end of a lead terminal such that the connector doesnot fall sideways.

If a defect occurs in connection of the connector, the controllabilityof an electronic element is deteriorated, and the reliability of anelectronic module is deteriorated.

SUMMARY OF INVENTION Technical Problem

In view of the above, the present invention provides an electronicmodule capable of improving reliability by suppressing a defect inconnection of a second connector.

Solution to Problem [Concept 1]

An electronic module according to the present invention may comprise:

a sealing part;

a rear surface-exposed conductor having a rear surface-exposed sideterminal part protruding outward from a side surface of the sealing partand a rear surface-exposed part whose rear surface is exposed;

a rear surface-unexposed conductor, whose rear surface is not exposed,having a rear surface-unexposed side terminal part protruding outwardfrom a side surface of the sealing part;

an electronic element provided in the sealing part and provided on afront surface of the rear surface-exposed conductor; and

a second connector for electrically connecting the electronic element tothe rear surface-unexposed conductor, wherein

the rear surface-unexposed conductor may be positioned on a frontsurface side compared with the rear surface-exposed part,

the second connector may have a second connection tip part and a secondconnection base part, the second connection tip part is positioned on arear surface side compared with the second connection base part, and

a distance H in a thickness direction between a rear surface side endpart of the second connection base part and a rear surface side end partof the second connection tip part may be larger than a width W of thesecond connection tip part of the second connector.

[Concept 2]

In the electronic module according to Concept 1,

the distance H in the thickness direction between the rear surface sideend part of the second connection base part and the rear surface sideend part of the second connection tip part may be larger than the widthW of the second connection tip part of the second connector.

[Concept 3]

In the electronic module according to Concept 1 or 2,

the second connection base part of the second connector may have asecond hole part, and

a total value of the distance H in the thickness direction between therear surface side end part of the second connection base part and therear surface side end part of the second connection tip part and adiameter D of the second hole part may be larger than the width W of thesecond connection tip part of the second connector.

[Concept 4]

In the electronic module according to any one of Concepts 1 to 3,

the second connection base part of the second connector may have asecond hole part, and

the distance H in the thickness direction between the rear surface sideend part of the second connection base part and the rear surface sideend part of the second connection tip part may be larger than a diameterD of the second hole part.

[Concept 5]

In the electronic module according to any one of Concepts 1 to 4,

the second connection base part of the second connector may have asecond hole part, and

a diameter D of the second hole part may be equal to or larger than thewidth W of the second connection tip part of the second connector.

[Concept 6]

In the electronic module according to any one of Concepts 1 to 5,

the rear surface-exposed conductor may have an internal bent part bentin the sealing part, and

the rear surface-unexposed conductor may not have an internal bent part.

[Concept 7]

In the electronic module according to any one of Concepts 1 to 6,

the rear surface-exposed conductor may have a connected part which isprovided between the rear surface-exposed part and the rearsurface-exposed side terminal part, and whose rear surface is notexposed, and

a thickness of the connected part may be thinner than a thickness of therear surface-exposed part and a thickness of the rear surface-exposedside terminal part.

[Concept 8]

In the electronic module according to any one of Concepts 1 to 7,

the electronic module may further comprise a fastening member insertionpart provided at a peripheral part of the sealing part and configured toinsert a fastening member,

the rear surface-exposed conductor may have a peripheral rearsurface-exposed conductor and an inner rear surface-exposed conductorprovided at a position farther from the fastening member insertion partthan the peripheral rear surface-exposed conductor, and

an area of the rear surface-exposed part of the peripheral rearsurface-exposed conductor may be smaller than an area of the rearsurface-exposed part of the inner rear surface-exposed conductor.

[Concept 9]

In the electronic module according to Concept 8,

a pair of fastening member insertion parts may be provided, and

in comparison with the area of the rear surface-exposed part of theinner rear surface-exposed conductor, a reduction amount of the rearsurface-exposed part of the peripheral rear surface-exposed conductor onone side may be larger than a reduction amount of the rearsurface-exposed part of the peripheral rear surface-exposed conductor onthe other side.

Effects of Invention

In the present invention, by increasing the distance H in the thicknessdirection between the rear surface side end part of the secondconnection base part and the rear surface side end part of the secondconnection tip part, it is possible to sink a tip part of the secondconnector into a conductive adhesive and so on. Therefore, by adoptingan aspect in which the distance H is larger than the width W of the tippart of the second connector, the second connector can be stablydisposed. As a result, defective connection of the second connector canbe suppressed, and reliability can be improved.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1(a) is an enlarged plan view of a second connector that can beused in a first embodiment of the present invention, and FIG. 1(b) is anenlarged side view of the second connector that can be used in the firstembodiment of the present invention and a side view when viewed from thearrow A in FIG. 2.

FIG. 2 is a plan view which is not illustrating a sealing part of theelectronic module according to the first embodiment of the presentinvention.

FIG. 3 is a plan view of the electronic module according to the firstembodiment of the present invention.

FIG. 4 is a plan view of a first connector and a second connector thatcan be used in the first embodiment of the present invention.

FIG. 5 is a perspective view for explaining the relationship among asecond terminal part, a fourth terminal part, a fifth terminal part, andthe like, which can be used in the first embodiment of the presentinvention.

FIG. 6 is a perspective view for explaining the relationship between afirst terminal part, a third terminal part, and the like, which can beused in the first embodiment of the present invention.

FIG. 7 is a circuit diagram of an electronic module according toembodiments of the present invention.

FIG. 8 is a bottom view of an electronic module according to the firstembodiment of the present invention.

FIG. 9(a) is a side view indicating the relationship between a firstconnector and an electronic element and a rear surface-exposed part,which can be used in the first embodiment of the present invention. FIG.9(b) is a side view indicating the relationship between a secondconnector and an unexposed part, an electronic element, and a rearsurface-exposed part, which can be used in the first embodiment of thepresent invention.

FIG. 10 is a side view indicating an aspect in which an electronicmodule according to embodiments of the present invention is placed on aheat radiation sheet.

FIG. 11(a) is a side view for explaining the thickness of a firstconnector that can be used in the first embodiment of the presentinvention. FIG. 11(b) is a side view for explaining a thickness of thesecond connector which can be used in the first embodiment of thepresent invention.

FIG. 12 is a plan view which is not illustrating a sealing part of anelectronic module according to a second embodiment of the presentinvention.

FIG. 13 is a plan view of an electronic module according to the secondembodiment of the present invention and a view illustrating the sealingpart in a translucent state.

FIG. 14(a) is a side view of a first rear surface-exposed conductor thatcan be used in an electronic module according to a third embodiment ofthe present invention.

FIG. 14(b) is a side view of a second rear surface-exposed conductorthat can be used in the electronic module according to the thirdembodiment of the present invention. FIG. 14(c) is a side view of athird rear surface-exposed conductor that can be used in the electronicmodule according to the third embodiment of the present invention.

FIG. 15 is a plan view which is not illustrating a sealing part of anelectronic module according to a fourth embodiment of the presentinvention.

FIG. 16(a) is a perspective view of a second connector that can be usedin embodiments of the present invention, when viewed from the secondconnection tip end part side. FIG. 16(b) is a view of the secondconnector that can be used in embodiments of the present invention, whenviewed from the bottom surface side.

DESCRIPTION OF EMBODIMENTS First Embodiment <<Configuration>>

As illustrated in FIG. 2, an electronic module according to the presentembodiment may have a sealing part 90 (refer to FIG. 3), rearsurface-exposed conductors 10, 20 and 30, which have rear surfaceexposed-side terminal parts 11, 21 and 31 protruding outwardly from aside surface of the sealing part 90 and rear surface-exposed parts 12,22 and 32 (refer to FIG. 8) whose rear surface is exposed, rearsurface-unexposed conductors 40 and 50, which have rear surfaceunexposed-side terminal parts 41 and 51 protruding outwardly from a sidesurface of the sealing part 90 and whose rear surface is not exposed, aplurality of electronic elements 15 and 25, which is provided in thesealing part 90 and provided on a front surface of the rearsurface-exposed conductors 10, 20, and 30 via a conductive adhesive 190(refer to FIG. 11) such as solder, and connectors 60 and 70, which havea first connector 60 and a second connector 70. The connectors 60 and 70have a first connector 60 and a second connector 70. In the presentembodiment, a direction including a direction from the rear surface sideto the front surface side of the sealing part 90 of an electronic moduleis referred to as a “first direction”, and a direction in a plane havinga normal to the first direction (an in-plane direction including thesecond direction and the third direction in FIG. 2) is referred to as an“in-plane direction”.

The first connector 60 of the present embodiment electrically connectsthe rear surface-exposed conductors 10, 20, and 30 and the electronicelements 15 and 25, and the second connector 70 electrically connectsthe rear surface-unexposed conductors 40 and 50 and the electronicelements 15 and 25. For example, the first connector 60 may connect thefront surfaces of the rear surface-exposed conductors 20 and 30 and asource electrode and the like provided on the front surface of the firstelectronic element 15 or the second electronic element 25 with theconductive adhesive 190. The second connector 70 may connect the frontfaces of the rear surface-unexposed conductors 40 and 50 and a gateelectrode and the like provided on the front surface of the firstelectronic element 15 or the second electronic element 25 with theconductive adhesive 190. However, the present invention is not limitedto this. The connectors 60 and 70 may connect two rear surface-exposedconductors 10, 20 and 30 or two rear surface-unexposed conductors 40 and50 to each other. For example, the first connector 60 may connect thetwo rear surface-exposed conductors 10, 20, and 30 to each other, andthe second connector 70 may connect the two rear surface-unexposedconductors 40 and 50 to each other.

As illustrated in FIG. 4, the first connector 60 may have a firstconnection base end part 61 and a first connection tip end part 62connected to the electronic elements 15 and 25 via the conductiveadhesive 190. A first hole 66 may be provided in each of the firstconnection base end part 61 and the first connection tip end part 62.The width of the first connection base end part 61 and the width of thefirst connection tip end part 62 may be substantially the same. In thepresent embodiment, “substantially the same” means that the differencetherebetween is 5% or less of a larger value. For example, W1−W0≤0.05×W1is satisfied when W1 is a large value, and W0 is a small value in thewidth of the first connection base end part 61 and the width of thefirst connection tip end part 62.

As illustrated in FIG. 4, the second connector 70 may have a secondconnection base end part 71 and a second connection tip end part 72, andthe width of the second connection base end part 71 may be larger thanthe width of the second connection tip end part 72. As illustrated inFIG. 1(a), the second connector 70 may have the second connection baseend part 71, the second connection base end part 71 may be provided witha second hole 76, and the second connection tip end part 72 may not beprovided with the second hole 76. As illustrated in FIG. 1(b), thesecond connection tip end part 72 may have a rear surface sideprotruding part 72 a protruding toward the rear surface side (also referto FIG. 16).

A distance H in the thickness direction between a rear surface side endpart of a second connection base part 71 and a rear surface side endpart of a second connection tip part 72 may be larger than a width W ofthe second connection tip part 72 of the second connector 70 (refer toFIG. 1).

The distance H in the thickness direction between the rear surface sideend part of the second connection base part 71 and the rear surface sideend part of the second connection tip part 72 may be larger than adiameter D of a second hole part 76.

The diameter D of the second hole part 76 may be equal to or larger thanthe width W of the second connection tip part 72 of the second connector70.

As illustrated in FIGS. 5 and 6, the rear surface-exposed conductors 10,20, and 30 may have internal bent parts 13, 23, and 33 bent in thesealing part 90. On the other hand, the rear surface-unexposedconductors 40 and 50 may not have the internal bent parts. Morespecifically, the rear surface-exposed conductors 10, 20, and 30 may beprovided between the rear surface exposed-side terminal parts 11, 21 and31 and the rear surface-exposed parts 12, 22, and 32 and may have theinternal bent parts 13, 23, and 33 bent from the rear surface-exposedparts 12, 22, and 32 to the side of the rear surface exposed-sideterminal parts 11, 21 and 31 (front surface side).

The rear surface-unexposed conductors 40 and 50 may be positionedfurther to the front surface side than the rear surface-exposed parts12, 22, and 32. A total value of the distance H in the thicknessdirection between the rear surface side end part of the secondconnection base part 71 and the rear surface side end part of the secondconnection tip part 72 and the diameter D of the second hole part 76 maybe larger than the width W of the second connection tip part 72 of thesecond connector 70.

The rear surface-unexposed conductors 40 and 50 may have unexposed parts42 and 52 sealed in the sealing part 90.

The electronic elements 15 and 25 are semiconductor elements such asMOSFETs, for example, and the electronic module may be a semiconductormodule, for example. The present embodiment will be described using theaspect in which the rear surface-exposed parts 12, 22, and 32 and therear surface exposed-side terminal parts 11, 21 and 31 are integrated,and the unexposed parts 42 and 52 and the back surface unexposed-sideterminal parts 41 and 51 are integrated, but the present invention isnot limited thereto. The rear surface-exposed parts 12, 22, and 32 andthe rear surface exposed-side terminal parts 11, 21 and 31 may beseparately formed and bonded to each other. Alternatively, the unexposedparts 42 and 52 and the rear surface unexposed-side terminal parts 41and 51 may be separately formed and bonded to each other.

The rear surface-exposed conductors 10, 20, and 30 may have the firstrear surface-exposed conductor 10, the second rear surface-exposedconductor 20, and the third rear surface-exposed conductor 30. The firstrear surface-exposed conductor 10 may have a first terminal part 11, afirst rear surface-exposed part 12, and a first internal bent part 13provided between the first terminal part 11 and the first rearsurface-exposed part 12. The second rear surface-exposed conductor 20may have a second terminal part 21, a second rear surface-exposed part22, and the second internal bent part 23 provided between the secondterminal part 21 and the second rear surface-exposed part 22. The thirdrear surface-exposed conductor 30 may have a third terminal part 31, athird rear surface-exposed part 32, and a third internal bent part 33provided between the third terminal part 31 and the third rearsurface-exposed part 32.

The rear surface unexposed-side terminal parts 41 and 51 may have afourth rear surface-unexposed conductor 40 and a fifth rearsurface-unexposed conductor 50. The fourth rear surface-unexposedconductor 40 may have a fourth terminal part 41 and the fourth unexposedpart 42. The fifth rear surface-unexposed conductor 50 may have a fifthterminal part 51 and a fifth unexposed part 52.

As illustrated in FIG. 2, the electronic elements 15 and 25 may have thefirst electronic element 15 placed on the first rear surface-exposedpart 12 and the second electronic element 25 placed on the second rearsurface-exposed part 22. As illustrated in FIG. 3, the second terminalpart 21 and the rear surface unexposed-side terminal parts 41 and 51 mayprotrude outwardly from one side surface (the lower surface in FIG. 3)of the sealing part 90.

As illustrated in FIG. 2, a plurality of the second rear surface-exposedconductors 20 may be provided. The rear surface unexposed-side terminalparts 41 and 51 may be provided between at least a pair of the secondrear surface-exposed parts 22, and the fourth terminal part 41 and thefifth terminal part 51 may be provided one by one between a pair of thesecond terminal parts 21. In the aspect illustrated in FIG. 2, thefourth unexposed part 42 integrated with the fourth terminal part 41 isprovided between a pair of the second rear surface-exposed parts 22, andthe fifth unexposed part 52 integrated with the fifth terminal part 51is provided on one side surface side (the lower side in FIG. 2) of thesecond rear surface-exposed part 22. The rear surface unexposed-sideterminal parts 41 and 51 may be connected to the electronic elements 15and 25, respectively. In the aspect illustrated in FIG. 2, the fifthterminal part 51 is connected to the second electronic element 25 by thesecond connector 70 and is used for controlling the second electronicelement 25, and the fourth terminal part 41 is connected to the firstelectronic element 15 by the second connector 70 and is used forcontrolling the first electronic element 15.

As illustrated in FIG. 2, the electronic elements 15 and 25 may not beplaced on the third rear surface-exposed part 32. As illustrated in FIG.3, the first terminal part 11 and the third terminal part 31 mayprotrude outwardly from the other side surface (the upper surface inFIG. 3) of the sealing part 90. The first terminal part 11 and the thirdterminal part 31 may be alternately disposed.

The rear surface-exposed conductors 10, 20, and 30 and the rearsurface-unexposed conductors 40 and 50 are made of, for example, copperand a copper alloy and may be subjected to a tin plating treatment, anickel plating treatment, or the like on the whole surface or partialsurface. As the sealing part 90, an epoxy resin or the like may be used.

As an electronic module, for example, a power electronic module may beused. As the first electronic element 15 and the second electronicelement 25, for example, MOSFETs may be used. A circuit diagram of theelectronic module according to the present embodiment is as illustratedin FIG. 7, for example. In the aspect illustrated in FIG. 7, the firstelectronic element 15 and the second electronic element 25 are MOSFETs.In FIG. 2, a drain of the MOSFET that is the first electronic element 15is positioned on the side of the first rear surface-exposed part 12, anda source is positioned on the side (the front surface side) opposite tothe first rear surface-exposed part 12. Further, a drain of the MOSFETthat is the second electronic element 25 is positioned on the side ofthe second rear surface-exposed part 22, and a source is positioned onthe side (the front surface side) opposite to the second rearsurface-exposed part 22.

The first rear surface-exposed conductor 10, the second rearsurface-exposed conductor 20, and the third rear surface-exposed part 30may be connected to each other. For example, the first rearsurface-exposed part 12 and the second rear surface-exposed part 22 maybe connected by the first connector 60 or a wire (not illustrated).Further, the second rear surface-exposed part 22 and the third rearsurface-exposed part 30 may be connected by the first connector 60 or awire (not illustrated). As the connectors 60 and 70, for example, acopper clip can be used, and for example, an aluminum wire can be usedas a wire. By using wide connectors 60 and 70, the amount of currentflowing can be increased.

As illustrated in FIG. 10, the first rear surface-exposed part 12, thesecond rear surface-exposed part 22, and the third rear surface-exposedpart 32 may be placed on a housing 200 via a heat radiation sheet 210, aheat radiation adhesive, and the like.

As illustrated in FIG. 3, each of the first terminal part 11, the secondterminal part 21, the third terminal part 31, the fourth terminal part41, and the fifth terminal part 51 may be bent toward the front surfaceside.

The electronic module of the present embodiment may be a three-phasebridge circuit. One of the three output terminals may be connected to aU-phase coil, another one may be connected to a V-phase coil, and theremaining one may be connected to a W-phase coil.

More specifically, in FIG. 7, the drain of the MOSFET which is the firstelectronic element 15 may be connected to the power supply line side,the source may be connected to the drain of the MOSFET which is thesecond electronic element 25, and the source of this MOSFET may beconnected to the ground. Further, a connection point between the firstelectronic element 15 and the second electronic element 25 may beconnected to a U-phase coil, a V-phase coil, or a W-phase coil of amotor.

In the case where the internal bent parts 13, 23, and 33 are provided,the connection surface (including the aspect contacting with theconductive adhesive 190) between the unexposed parts 42 and 52 and thesecond connector 70 and the connection surface (including the aspectcontacting with the conductive adhesive 190) between the rearsurface-exposed parts 12, 22, and 32 and the first connector 60 differin positions in the height direction. More specifically, in the aspectillustrated in FIG. 9, the height position of the connection surface ofthe second connection base end part 71 with the fourth unexposed part 42and the height position of the connection surface of the secondconnection base end part 71 with the fifth unexposed part 52 are higherthan the height position of the connection surface of the firstconnection base end part 61 with the second rear surface-exposed part 22and the height position of the connection surface of the firstconnection base end part 61 with the third rear surface-exposed part 32.

As illustrated in FIGS. 3 and 8, a fastening member insertion part 170for inserting a fastening member such as a screw for fixing anelectronic module to a heat sink, the housing 200, and the like may beprovided on the peripheral part of the sealing part 90.

<<Function/Effect>>

Next, among the functions and effects of the present embodiment havingthe above-described configuration, those which have not been describedyet will be described. Any of the aspects described in “Function/Effect”can be applied in the above-described configuration.

In the present embodiment, by increasing the distance H in the thicknessdirection between the rear surface side end part of the secondconnection base part 71 and the rear surface side end part of the secondconnection tip part 72, it is possible to sink a tip part of the secondconnector 70 into a conductive adhesive 190. Therefore, by adopting anaspect in which the distance H is larger than the width W of the tippart of the second connector 70, the second connector 70 can be stablydisposed. As a result, defective connection of the second connector 70can be suppressed, and reliability can be improved.

Further, by providing the second hole part 76 and increasing thediameter D of the second hole part 76, the second connection base part71 can be sunk into the conductive adhesive 190. Therefore, by adoptingan aspect in which the second hole part 76 is provided, a total value ofthe distance H and a total value of the diameter D of the second holepart 76 is larger than the width W of the tip part of the secondconnector 70, the second connector 70 can be further stably disposed. Asa result, defective connection of the second connector 70 can besuppressed, and reliability can be further improved.

In the case where an aspect is applied in which the distance H in thethickness direction between the rear surface side end part of the secondconnection base part 71 and the rear surface side end part of the secondconnection tip part 72 is larger than the width W of a tip part of thesecond connector 70, the tip part of the second connector 70 can sinkinto the conductive adhesive 190 by increasing the distance H anddecreasing the width W of the tip part of the second connector 70.Therefore, it is possible to improve reliability by stably arranging thesecond connector 70 to suppress defective connection of the secondconnector 70.

In the case where an aspect is applied in which the distance H in thethickness direction between the rear surface side end part of the secondconnection base part 71 and the rear surface side end part of the secondconnection tip part 72 is larger than the diameter D of the second holepart 76, the effect of increasing the distance H is prioritized over theeffect of increasing the diameter D of the second hole part 76, and thetip part of the second connector 70 can sink into the conductiveadhesive 190. Therefore, it is possible to improve reliability by stablyarranging the second connector 70 to suppress defective connection ofthe second connector 70.

In the case where an aspect is applied in which the diameter D of thesecond hole part 76 is equal to or larger than the width W of the tippart of the second connector 70, by increasing the diameter D of thesecond hole part 76, the base part of the second connector 70 can sinkinto the conductive adhesive 190. Therefore, it is possible to improvereliability by stably arranging the second connector 70 to suppressdefective connection of the second connector 70.

In the present embodiment, in the case where the aspect of which thethickness T1 of the first connector 60 for electrically connecting theelectronic elements 15 and 25 to the rear surface-exposed conductors 10,20, and 30 is thicker than the thickness T2 of the second connector 70for electrically connecting the electronic elements 15 and 25 to therear surface-unexposed conductors 40 and 50 is applied (refer to FIG.11), the first connector 60 can prevent the rear surface-exposed parts12, 22, and 32 from floating up when the rear surface-exposed parts 12,22, and 32 are pressed by a pressing member such as a press pin to poura sealing resin. Therefore, it is possible to prevent the resin fromwrapping around to the rear surface side of the rear surface-exposedparts 12, 22, and 32 and also prevent occurrence of defective appearanceand burrs.

If the thickness T1 of the first connector 60 is smaller than 1.2 timesof the thickness T2 of the second connector 70, the pressing force bythe first connector 60 against the rear surface-exposed parts 12, 22,and 32 may be reduced. On the other hand, if the thickness T1 of thefirst connector 60 is greater than 1.5 times of the thickness T2 of thesecond connector 70, the weight of the first connector 60 becomes tooheavy, and the thickness of the conductive adhesive 190 such as solderto be disposed on the rear surface side of the first connector 60 is notsufficiently maintained, and as a result, the reliability may belowered. Therefore, it is useful that the thickness T1 of the firstconnector 60 is 1.2 times or more and 1.5 times or less the thickness T2of the second connector 70.

In the case where the aspect of which the thickness T1 of the firstconnector 60 is thinner than the thicknesses of the rear surface-exposedconductors 10, 20, and 30 and the rear surface-unexposed conductors 40and 50 is applied, it is possible to prevent the weight of the firstconnector 60 from being too heavy and possible to sufficiently maintainthe thickness of the conductive adhesive 190 such as solder to bedisposed on the rear surface side of the first connector 60.

In the case where the aspect of which the first hole 66 is provided ineach of the first connection base end part 61 and the first connectiontip end part 62 is applied, it is advantageous in that whether or notthe conductive adhesive 190 such as solder is adhered to each rearsurface of the first connection base end part 61 and the firstconnection tip end part 62 can be visually confirmed.

As illustrated in FIG. 1(a), in the case where the aspect of which thewidth of the second connection base end part 71 is larger than the widthof the second connection tip end part 72 is applied, it is advantageousin that the size in the in-plane direction of the second connector 70can be reduced. In the case where the aspect of which the second hole 76is provided in the second connection base end part 71 is applied, it isadvantageous in that whether or not the conductive adhesive 190 such assolder is adhered to the rear surface of the second connection base endpart 71 can be visually confirmed. On the other hand, in the case wherethe aspect of which the width of the second connection tip end part 72is narrower than the width of the second connection base end part 71 isapplied, the second connection tip end part 72 may not be provided withthe second hole 76. This is because, in the case where the width of thesecond connection tip end part 72 is narrow, whether or not theconductive adhesive 190 such as solder is adhered to the secondconnection tip end part 72 without providing the second hole 76 can bevisually confirmed.

In the present embodiment, in the case where the aspect of which thefirst connector 60 is provided corresponding to each of the rearsurface-exposed parts 12, 22, and 32, and each of the rearsurface-exposed parts 12, 22, and 32 is pressed by a pressing membersuch as a press pin when a sealing resin is poured is applied, it ispossible to prevent a portion not pressed by the connectors 60 and 70from being floated while pressing the rear surface-exposed parts 12, 22,and 32. Therefore, it is possible to prevent the resin from wrappingaround to the rear surface side of the rear surface-exposed parts 12,22, and 32 and is also possible to prevent occurrence of defectiveappearance and burrs.

On a front surface of a sealing part 90, pressing holes or pressingimpressions 110, 120, and 130 may be provided (refer to FIG. 3). Thepress hole is a hole provided on the front surface of the sealing part90. For example, after pressing the rear surface-exposed conductors 10,20, and 30 with press pins, a part of them is sealed in the sealing part90. The pressing impressions 110, 120, and 130 are, for example,impressions obtained such that after the rear surface-exposed conductors10, 20, and 30 are pressed by press pins, all of them are sealed with asealing resin. Even if all of them are sealed with a sealing resin asdescribed above, in general, a boundary line is formed between theoriginal sealing part and the sealing resin embedded later, and regionspartitioned by the boundary line are the pressing impressions 110, 120,and 130 (refer to FIG. 3). It is possible to determine whether each ofthe rear surface-exposed conductors 10, 20, and 30 is pressed by apressing member such as a press pin by the pressing holes and pressingimpressions 110, 120, and 130. The aspect illustrated in FIG. 3indicates the first pressing impression 110 for the first rearsurface-exposed conductor 10, the second pressing impression 120 for thesecond rear surface-exposed conductor 20, and the third pressingimpression 130 for the third rear surface-exposed conductor 30.

In the present embodiment, in the case where the aspect of which therear surfaces of the rear surface-exposed parts 12, 22, and 32 on whichthe electronic elements 15 and 25 are placed are exposed is applied, aheat radiation effect can be expected (refer to FIGS. 2 and 8). On theother hand, in the case where the aspect of which the unexposed parts 42and 52 are sealed in the sealing part 90 is applied, the possibilitythat the rear surface-unexposed conductors 40 and 50 come out from thesealing part 90 can be reduced. In this case, since the unexposed parts42 and 52 are not exposed from the rear surface, defective appearance inthe unexposed parts 42 and 52 due to burrs of the sealing part 90 is notcaused. Generally, it is difficult to press down to seal with resin whenthe width is narrow, and burrs caused by the sealing part 90 are likelyto occur. However, it is advantageous in that, by using the unexposedparts 42 and 52 not exposed outwardly, burrs are not caused.

In the case where the aspect having the internal bent parts 13, 23, and33 as illustrated in FIGS. 5 and 6 is applied, as illustrated in FIG. 8,the rear surface-exposed conductors 10, 20, and 30 are sealed in theperipheral part of the sealing part 90, and it is possible to morereliably prevent the rear surface-exposed conductors 10, 20, and 30 fromcoming out from the sealing part 90. In addition, in the case where theaspect of which the rear surface of the sealing part 90 has a flat shapewhile using the internal bent parts 13, 23, and 33 is applied, it ispossible to prevent the conductor surface from being exposed at theperipheral part of the rear surface of the sealing part 90 withoutproviding a protruding part or the like on the rear surface of thesealing part 90. Therefore, it is also advantageous in that it isunnecessary to process a heat sink, the housing 200, and the likecorresponding to the projecting part.

In the case where the conductor surface is exposed at the peripheralpart of the rear surface of the sealing part 90, there is a possibilitythat a current leaks from an unexpected part. On the other hand, byusing the internal bent parts 13, 23, and 33 as in the presentembodiment, it is possible to prevent the conductor surface from beingexposed at the periphery of the rear surface of the sealing part 90. Asa result, it is advantageous in that the possibility that a currentleaks from unexpected places can be reduced, and reliability can beimproved. Further, the distance between the rear surface-exposed parts12, 22, and 32 and the unexposed parts 42 and 52 can be increased whilematching positions in the height direction of the rear surfaceexposed-side terminal parts 11, 21 and 31 and the rear surfaceunexposed-side terminal parts 41 and 51 by using such internal bentparts 13, 23, and 33. As a result, the distance between the electronicelements 15 and 25 and the unexposed parts 42 and 52 can be increased,and adverse effects on the current flowing through the rear surfaceunexposed-side terminal parts 41 and 51 due to heat generated from theelectronic elements 15 and 25 can be prevented.

Further, by not making the conductor surface be exposed at theperipheral part of the rear surface of the sealing part 90, the size ofthe heat radiation sheet 95 (refer to FIG. 10) can be reduced, and alsothe manufacturing cost can be reduced.

As illustrated in FIG. 2, in the case where the aspect of which thefirst electronic element 15 is placed on the first rear surface-exposedpart 12 whose rear surface is exposed is applied, heat generated fromthe first electronic element 15 can be efficiently dissipated.Similarly, in the case where the aspect of which the second electronicelement 25 is placed on the second rear surface-exposed part 22 whoserear surface is exposed is applied, heat generated from the secondelectronic element 25 can be efficiently dissipated.

In the case where the aspect of which the second rear surface-exposedpart 22 on which the second electronic element 25 is placed and theunexposed parts 42 and 52 on which the electronic elements 15 and 25 arenot placed are positioned on one side surface side (one side surfaceside from the center in the short side direction, the lower side in FIG.2) is applied, it is advantageous in that heat generated from the secondelectronic element 25 can be efficiently dissipated from the second rearsurface-exposed part 22 on one side surface side of the rear surface.

As illustrated in FIG. 2, in the case where the aspect of which thefourth terminal part 41 and the fifth terminal part 51 are providedbetween the second terminal parts 21 in the longitudinal direction ofthe sealing part 90 is applied, the second terminal part 21 which iseasily affected by heat generated from the second electronic element 25and the fourth terminal part 41 and the fifth terminal part 51 which arenot easily affected by heat generated from the electronic elements 15and 25 can be disposed in a well-balanced manner. Therefore, the heatgenerated from the second electronic element 25 can be dissipatedefficiently via the second terminal part 21.

In the case where the aspect of which the unexposed parts 42 and 52 areprovided between a pair of the second rear surface-exposed parts 22 inthe longitudinal direction of the sealing part 90 is applied, the secondrear surface-exposed part 22 on which the second electronic element 25is placed and the unexposed parts 42 and 52 on which the electronicelements 15 and 25 are not placed can be disposed in a well-balancedmanner. Therefore, the heat generated from the second electronic element25 can be dissipated efficiently via the first rear surface-exposed part12.

In the case where the aspect of which the fourth unexposed part 42 isprovided between a pair of the second rear surface-exposed parts 22 inthe longitudinal direction of the sealing part 90, and the fifthunexposed part 52 is provided on one side surface side of the secondrear surface-exposed part 22 is applied (the lower side in FIG. 2), itis advantageous in that the fourth unexposed part 42 and the fifthunexposed part 52 can be provided while the size of the second rearsurface-exposed part 22 is increased as much as possible.

As illustrated in FIG. 2, in the case where the aspect of which thefirst rear surface-exposed part 12 on which the first electronic element15 is placed and the third rear surface-exposed part 32 on which theelectronic elements 15 and 25 are not placed are positioned on the otherside surface side (the other side surface side from the center in theshort side direction, the upper side in FIG. 2) is applied, it isadvantageous in that heat generated from the first electronic element 15can be efficiently dissipated via the first rear surface-exposed part 12on the other side surface side of the rear surface.

In the case where the aspect of which the first terminal part 11 and thethird terminal part 31 are alternately arranged is applied, the firstterminal part 11, which is easily affected by heat generated from thefirst electronic element 15, and the third terminal part 31 which is noteasily affected by heat generated from the electronic elements 15 and 25can be disposed in a well-balanced manner. Therefore, the heat generatedfrom the first electronic element 15 can be dissipated efficiently viathe first terminal part 11.

In the case where the aspect of which the first rear surface-exposedpart 12 and the third rear surface-exposed part 32 are alternatelydisposed is applied, the first rear surface-exposed part 12 on which thefirst electronic element 15 is placed and the third rear surface-exposedpart 32 on which the electronic elements 15 and 25 are not placed can bedisposed in a well-balanced manner. Therefore, the heat generated fromthe first electronic element 15 can be efficiently dissipated from thefirst rear surface-exposed part 12.

In the case where the aspect of which each of the first rearsurface-exposed part 12, the second rear surface-exposed part 22, andthe third rear surface-exposed part is formed separately is applied,those are not easily affected by high frequency or the like (noise orthe like) in the other terminal part. Particularly, in a three-phasebridge circuit, the influence of high frequency or the like (noise orthe like) may become a problem. Therefore, in the three-phase bridgecircuit, it is extremely useful to apply the aspect of which each of thefirst rear surface-exposed part 12, the second rear surface-exposed part22, and the third rear surface-exposed part is separately formed.

As illustrated in FIG. 2, by uniformly arranging a plurality ofelectronic elements 15 and 25, it is possible to radiate heat uniformly.Further, by equally arranging a plurality of electronic elements 15 and25 in this manner, mounting of the electronic elements 15 and 25 can beperformed quickly, and productivity can be enhanced. “Equal” in thepresent embodiment means that the distances between a plurality of thefirst electronic elements 15 have the same value, the distances betweena plurality of the second electronic elements 25 have the same value, aplurality of the second electronic elements 25 is disposed on one sidesurface side (the lower side in FIG. 2) from the center line extendingin the longitudinal direction (the right and left direction in FIG. 2)of an electronic module, a plurality of the first electronic elements 15is disposed on the other side surface side (the upper side in FIG. 2),and the first electronic element 15 and the second electronic element 25are disposed in a nested manner. For example, as illustrated in FIG. 2,a plurality of (three in the aspect in FIG. 2) the second electronicelements 25 is disposed at equal intervals in the right and leftdirections on the lower side of FIG. 2 from the longitudinal center lineof the electronic module, and a plurality of (three in the aspect in theFIG. 2) the first electronic elements 15 is disposed at equal intervalsin the right and left direction on the upper side of FIG. 2 from thecenter line in the longitudinal direction, and the first electronicelement 15 and the second electronic element 25 are disposed in a nestedmanner. A wire can be used instead of the first connector 60 and/or thesecond connector 70.

When the connectors 60 and 70 such as clips are used, it is necessary toprepare the connectors 60 and 70 beforehand. However, by equallyarranging a plurality of the electronic elements 15 and 25, the types ofthe connectors 60 and 70 to be prepared can be reduced. For example,according to the aspect illustrated in FIG. 2, the length of the firstconnector 60 connecting the front surface of the second electronicelement 25 and the third rear surface-exposed part 32 and the length ofthe first connector 60 connecting the front surface of the firstelectronic element 15 and the second rear surface-exposed part 22 can bemade substantially the same. Therefore, it is advantageous in that, forexample, one type of the first connector 60 connecting the electronicelements 15 and 25 and the rear surface-exposed parts 12, 22, and 32 canbe provided. Further, by using one type of the first connectors 60 forconnecting the electronic elements 15 and 25 and the rearsurface-exposed parts 12, 22, and 32, it is also advantageous in thatthe amount of current flowing through each of the first connectors 60can be substantially the same.

In addition, as illustrated in FIG. 2, in the case where the aspect ofwhich the fourth unexposed part 42 is provided between a pair of thesecond rear surface-exposed parts 22, and the fifth unexposed part 52 isprovided on one side surface side of the second rear surface-exposedpart 22 is applied, the length of the second connector 70 for connectingthe fourth unexposed part 42 and the front surface of the firstelectronic element 15 and the length of the second connector 70connecting the fifth unexposed part 52 and the front surface of thesecond electronic element 25 can be made substantially the same.Therefore, it is advantageous in that, for example, one type of thesecond connectors 70 connecting the unexposed parts 42 and 52 and theelectronic elements 15 and 25 can be provided. Further, by using onetype of the second connectors 70 connecting the unexposed parts 42 and52 and the electronic elements 15 and 25 as described above, if theelectronic elements 15 and 25 are the same, it is advantageous in thatthe electronic elements 15 and 25 can be controlled at the same current.

For example, as illustrated in FIG. 2, when the front surface of thefirst electronic element 15 is connected to the second rearsurface-exposed part 22, the front surface of the second electronicelement 25 is connected to the third rear surface-exposed part 32, thefirst terminal part 11 can be used as an input terminal, the secondterminal part 21 can be used as an output terminal, and the thirdterminal part 31 can be used as a ground terminal. For this reason, thecurrent input from one side in the short side direction of theelectronic module (the upper side in FIG. 2) can flow to the other sidein the short-side direction of the electronic module (the lower side inFIG. 2), and the current does not make a U-turn. Therefore, the wiringlength can be suppressed, and as a result, impedance and inductance canbe reduced. Further, it is possible to reduce the size of the electronicmodule and to reduce the cost.

Second Embodiment

Next, a second embodiment of the present invention will be described.

As indicated in FIG. 12, grooves 150 may be provided on the frontsurfaces of the rear surface-exposed parts 12, 22, and 32 of the rearsurface-exposed conductors 10, 20, and 30. As indicated in FIG. 12, thegroove 150 may be provided in each of the rear surface-exposedconductors 10, 20, and 30 or may be provided only in a part of the rearsurface-exposed conductors 10, 20, and 30. As indicated in FIG. 13, inthe longitudinal direction of the sealing part 90 in the in-planedirection, the center portion of the press holes or press impressions110, 120, and 130 may be provided on the side opposite to the connectors60 and 70 or the electronic elements 15 and 25 with respect to thegroove 150. The groove 150 of the present embodiment does not penetratethrough the rear surface-exposed parts 12, 22, and 32, and the recessesformed in the rear surface-exposed parts 12, 22, and 32 are the grooves150. However, the present invention is not limited to such an aspect,and the groove 150 may penetrate through the rear surface-exposed parts12, 22, and 32.

With respect to at least a part of the grooves 150, in the longitudinaldirection of the sealing part 90 in the in-plane direction (the thirddirection in FIG. 13), the entirety of the press holes or pressimpressions 110, 120, and 130 may be provided on the side opposite tothe connectors 60 and 70 or the electronic elements 15 and 25 withrespect to the groove 150. Further, with respect to all the grooves 150,in the longitudinal direction of the sealing part 90 in the in-planedirection, the entirety of the press holes or press impressions 110,120, and 130 may be provided on the side opposite to the connectors 60and 70 or the electronic elements 15 and 25 with respect to the groove150.

With respect to at least a part of the grooves 150, in the longitudinaldirection of the sealing part 90 in the in-plane direction (the thirddirection in FIG. 13), a part of the press holes or press impressions110, 120, and 130 may be provided on the side opposite to the connectors60 and 70 or the electronic elements 15 and 25 with respect to thegroove 150. Further, with respect to all the grooves 150, in thelongitudinal direction of the sealing part 90 in the in-plane direction,only a part of the press holes or press impressions 110, 120, and 130may be provided on the side opposite to the connectors 60 and 70 or theelectronic elements 15 and 25 with respect to the groove 150.

Multiple types of the grooves 150 may be mixed, and in the longitudinaldirection of the sealing part 90 in the in-plane direction in a part ofa plurality of the rear surface-exposed conductors 10, 20, and 30, theentirety of the press holes or press impressions 110, 120, and 130 maybe provided on the side opposite to the connectors 60 and 70 or theelectronic elements 15 and 25 with respect to the groove 150, and in thelongitudinal direction of the sealing part 90 in the in-plane direction,in a part of or the entirety of the remaining part, only a part of thepress holes or press impressions 110, 120, and 130 may be provided onthe side opposite to the connectors 60 and 70 or the electronic elements15 and 25 with respect to the groove 150.

In the aspect illustrated in FIG. 13, a part of the first pressimpression 110 is provided on the side opposite to the first electronicelement 15 provided on the first rear surface-exposed part 12 withrespect to the groove 150 provided in the first rear surface-exposedpart 12, the entirety of the second press impression 120 is provided onthe side opposite to the second electronic element 25 provided in thesecond rear surface-exposed part 22 with respect to the groove 150provided in the second rear surface-exposed part 22, and a part of thethird press impression 130 is provided on the side opposite to the firstconnector 60 provided in the third rear surface-exposed part 32 withrespect to the groove 150 provided in the third rear surface-exposedpart 32.

As indicated in FIG. 13, the grooves 150 may not be provided in the rearsurface-unexposed conductors 40 and 50. However, the present inventionis not limited to such an aspect, and the grooves 150 may be provided inthe rear surface-unexposed conductors 40 and 50.

In the case where the aspect of which, in the longitudinal direction ofthe sealing part 90 in the in-plane direction, the center portion of thepress holes or press impressions 110, 120, and 130 is provided on theside opposite to the connectors 60 and 70 or the electronic elements 15and 25 with respect to the groove 150 is applied, by deflecting aportion to be pressed by a pressing member such as a press pin to acertain extent, floating of the rear surface-exposed parts 12, 22, and32 on the side opposite to the portion pressed by the pressing memberwith respect to the groove 150 can be prevented. Therefore, it ispossible to prevent the resin from wrapping around to the rear surfaceside of the rear surface-exposed parts 12, 22, and 32 and also preventoccurrence of defective appearance and burrs.

In the case where the aspect of which, in the longitudinal direction ofthe sealing part 90 in the in-plane direction, the entirety of the pressholes or press impressions 110, 120, and 130 are provided on the sideopposite to the connectors 60 and 70 or the electronic elements 15 and25 with respect to the groove 150 is applied, the portion to be pressedby a pressing member such as a press pin can be surely deflected, andfloating of the rear surface-exposed parts 12, 22, and 32 on the sideopposite to the portion pressed by the pressing member with respect tothe groove 150 can be surely prevented.

Even in the case where the aspect of which, in the longitudinaldirection of the sealing part 90 in the in-plane direction, only a partof the press holes or press impressions 110, 120, and 130 are providedon the side opposite to the connectors 60 and 70 or the electronicelements 15 and 25 with respect to the groove 150 is applied, theportion to be pressed by a pressing member such as a press pin can bedeflected to a certain extent, and the floating of the rearsurface-exposed parts 12, 22, and 32 on the side opposite to the portionpressed by the pressing member with respect to the groove 150 can beprevented to a certain extent. Further, in the case where the aspect ofwhich only a part of the press holes or press impressions 110, 120, and130 are provided on the side opposite to the connectors 60 and 70 or theelectronic elements 15 and 25 with respect to the groove 150 is applied,since it is not necessary to increase the size of a space in thein-plane direction to be pressed with a press pin, it is advantageous inthat the increase in size in the in-plane direction can be prevented.

Even in the case where the aspect of which, in the short-side direction(second direction) of the sealing part 90 in the in-plane direction, thepress holes or press impressions 110, 120, and 130 are positionedbetween the groove 150 and the rear surface exposed-side terminal parts11, 21 and 31 of the rear surface-exposed parts 12, 22, and 32 isapplied, it is advantageous in that the increase in size in the in-planedirection can be prevented without providing a large space in thein-plane direction to be pressed with a press pin.

When multiple types of the grooves 150 are mixed, and the aspect inwhich the entirety of the press holes or press impressions 110, 120, and130 are provided on the side opposite to the connectors 60 and 70 or theelectronic elements 15 and 25 with respect to the groove 150 and theaspect in which only a part of the press holes or press impressions 110,120, and 130 are provided on the side opposite to the connectors 60 and70 or the electronic elements 15 and 25 with respect to the groove 150are mixed, it is advantageous in that the design aspect can beappropriately changed.

In the above description, the first embodiment is described as apremise, but the present invention is not limited thereto, and only thecharacteristic configuration of the aspect of the present embodiment maybe applied without applying the characteristic configuration of theaspect of the first embodiment. For example, unlike the firstembodiment, a total value of the distance H between the rear surfaceside end part of the rear surface-unexposed conductors 40 and 50 and therear surface side end part of the tip part and the diameter D of thesecond hole part 76 may not be larger than the width W of the tip partof the second connector 70.

Third Embodiment

Next, a third embodiment of the present invention will be described.

In the present embodiment, as illustrated in FIG. 14, the rearsurface-exposed conductors 10, 20, and 30 are provided between the rearsurface-exposed parts 12, 22, and 32 and the rear surface exposed-sideterminal parts 11, 21 and 31, and the connected parts 16, 26 and 36whose rear surface is not exposed are provided. More specifically, theconnected parts 16, 26 and 36 whose rear surface is not exposed areprovided between the internal bent parts 13, 23, and 33 and the rearsurface-exposed parts 12, 22, and 32. The thickness of the connectedparts 16, 26 and 36 is thinner than the thickness of the rearsurface-exposed parts 12, 22, and 32 and the thickness of the rearsurface exposed-side terminal parts 11, 21 and 31. For example, thethickness of the rear surface-exposed parts 12, 22, and 32 and thethickness of the rear surface exposed-side terminal parts 11, 21 and 31are substantially the same, and the thickness of the connected parts 16,26 and 36 is 0.7 to 0.9 times of the thickness of the rearsurface-exposed parts 12, 22, and 32 and the thickness of the rearsurface exposed-side terminal parts 11, 21 and 31. Any configurationapplied in each of the above-described embodiments can also be appliedin the present embodiment. The same reference numerals are used todescribe the members described in the above embodiments.

By making the thickness of the connected parts 16, 26 and 36 thinnerthan the thickness of the rear surface-exposed parts 12, 22, and 32 andthe thickness of the rear surface exposed-side terminal parts 11, 21 and31, an unexpected exposed surface can be prevented from being formedbetween the rear surface-exposed parts 12, 22, and 32 and the rearsurface exposed-side terminal parts 11, 21 and 31. That is, as in thepresent embodiment, in the case where the thin connected parts 16, 26and 36 are not provided, and the rear surface-exposed parts 12, 22, and32 and the rear surface exposed-side terminal parts 11, 21 and 31, whichhave the same thickness, are continuously connected, a part which is notsealed with a sealing resin like a void may be generated at the boundarybetween the rear surface-exposed parts 12, 22, and 32 and the rearsurface exposed-side terminal parts 11, 21 and 31. When such a portionnot sealed with a sealing resin is generated as described above, theconnected parts 16, 26 and 36 positioned at the boundary between therear surface-exposed parts 12, 22, and 32 and the terminal part areexposed on the rear surface. As a result, defective appearance iscaused, and the product value may be lowered or it may not be acceptedas a product. Therefore, it is advantageous that, by providing theconnected parts 16, 26 and 36 as in this embodiment, the occurrence of aportion not sealed with a sealing resin is prevented at the boundarybetween the rear surface-exposed parts 12, 22, and 32 and the rearsurface exposed-side terminal parts 11, 21 and 31.

The width of the connected parts 16, 26 and 36 may be substantially thesame as the width of the rear surface exposed-side terminal parts 11, 21and 31. That is, although the thickness of the connected parts 16, 26and 36 is thinner than that of the rear surface exposed-side terminalparts 11, 21 and 31, the width may be substantially the same as that ofthe rear surface exposed-side terminal parts 11, 21 and 31. When such anaspect is applied, it is advantageous in that the appearance from thefront surface side or the rear surface side can be improved.

In the above description, each embodiment is described as a premise, butthe present invention is not limited thereto, and only thecharacteristic configuration of the aspect of the present embodiment maybe applied without applying the characteristic configuration of theaspect of each embodiment.

Fourth Embodiment

Next, a fourth embodiment of the present invention will be described.

The rear surface-exposed conductors 10, 20, and 30 have a peripheralrear surface-exposed conductor and an inner rear surface-exposedconductor provided at a position farther from the fastening memberinsertion part 170 than the peripheral rear surface-exposed conductor.The area of the rear surface-exposed part of the peripheral rearsurface-exposed conductor is smaller than the area of the rearsurface-exposed part of the inner rear surface-exposed conductor. In theaspect illustrated in FIG. 15, a second rear surface-exposed conductor20 a and a third rear surface-exposed conductor 30 a positioned at theleft end part of FIG. 15 and a first rear surface-exposed conductor 10 apositioned at the right end part of FIG. 15 are peripheral rearsurface-exposed conductors, and the rear surface-exposed conductors 10,20, and 30 other than the above are inner rear surface-exposedconductors 10 b, 20 b, and 30 b. Any configuration applied in each ofthe above-described embodiments can also be applied in the presentembodiment. The same reference numerals are used to describe the membersdescribed in the above embodiments.

When a fastening member is inserted and fastened to the fastening memberinsertion part 170 (refer to FIG. 3), the rear surface-exposedconductors 10, 20, and 30 are pressed against a heat sink or a coolingbody such as the housing 200 (refer to FIG. 10), and the coolingefficiency increases. The peripheral rear surface-exposed conductorclose to the fastening member insertion part 170 is strongly pressedagainst a cooling body as compared with the inner rear surface-exposedconductor, and therefore the cooling efficiency is further enhanced. Asin the present embodiment, by reducing the area of rear surface-exposedparts 12 a, 22 a, and 32 a of the peripheral rear surface-exposedconductors 10 a, 20 a, and 30 a is made smaller than the area of rearsurface-exposed parts 12 b, 22 b, and 32 b of the inner rearsurface-exposed conductors 10 b, 20 b, and 30 b, it is advantageous inthat the cooling efficiency for each of the electronic elements 15 and25 can be set to about the same level, and the size in the in-planedirection can be reduced.

The rear surface-exposed parts 12 a, 22 a, and 32 a of the peripheralrear surface-exposed conductors 10 a, 20 a, and 30 a have inclined parts19, 29, and 39. By providing the inclined parts 19, 29, and 39, the areaof the rear surface-exposed parts 12, 22, and 32 may be reduced. In thecase where the aspect of which the inclined parts 19, 29, and 39 areprovided as described above is applied, it is advantageous in that theprocessing thereof is easy even if the area of the rear surface-exposedparts 12, 22, and 32 is reduced.

In the present embodiment, a pair of the fastening member insertionparts 170 is provided. In the present embodiment, as compared with thearea of the rear surface-exposed parts 12 b, 22 b, and 32 b of the innerrear surface-exposed conductors 10 b, 20 b, and 30 b, the reductionamount of the rear surface-exposed parts 12 a and 32 a of the peripheralrear surface-exposed conductors 10 a and 30 a on one side (left side inFIG. 15) may be larger than the reduction amount of the rearsurface-exposed part 22 a of the peripheral rear surface-exposedconductor 20 a on the other side (the right side in FIG. 15). Inparticular, the reduction amount of the rear surface-exposed parts 22 aand 32 a of the peripheral rear surface-exposed conductors 20 a and 30 amay be increased since heat dissipation can also be expected on the sidewhere wide terminals, both the first terminal part 11 and the thirdterminal part 31 in the aspect illustrated in FIG. 15, are provided, incomparison with the side where narrow terminals, the fourth terminalpart 41 and the fifth terminal part 51 in the aspect illustrated in FIG.15, are provided. By applying such an aspect, it is advantageous in thatthe size in the in-plane direction can be further reduced.

In the above description, each embodiment is described as a premise, butthe present invention is not limited thereto, and only thecharacteristic configuration of the aspect of the present embodiment maybe applied without applying the characteristic configuration of theaspect of each embodiment.

The descriptions of the above-described embodiments and the disclosureof the drawings are merely examples for explaining the inventiondescribed in claims, and the invention described in claims is notlimited by the description of the above-described embodiments or thedisclosure of the drawings. In addition, the description in claims atthe beginning of the application is merely an example, and thedescription of claims can be appropriately changed based on thedescription in the specification, drawings, and the like.

REFERENCE SIGNS LIST

-   10 first rear surface-exposed conductor-   11 first terminal part (rear surface exposed-side terminal part)-   12 first rear surface-exposed part (rear surface-exposed part)-   15 first electronic element (electronic element)-   16 connected part-   20 second rear surface-exposed conductor-   21 second terminal part (rear surface exposed-side terminal part)-   22 second rear surface-exposed part (rear surface-exposed part)-   25 second electronic element (electronic element)-   26 connected part-   30 third rear surface-exposed conductor-   31 third terminal part (rear surface exposed-side terminal part)-   32 third rear surface-exposed part (rear surface-exposed part)-   36 connected part-   40 first rear surface-unexposed conductor (rear surface-unexposed    conductor)-   50 second rear surface-unexposed conductor (rear surface-unexposed    conductor)-   60 first connector-   70 second connector-   71 second connection base part-   72 second connection tip part-   76 second hole part-   90 sealing part-   110 first press impression-   120 second press impression-   130 third press impression-   170 fastening member insertion part

1. An electronic module comprising: a sealing part; a rearsurface-exposed conductor having a rear surface-exposed side terminalpart protruding outward from a side surface of the sealing part and arear surface-exposed part whose rear surface is exposed; a rearsurface-unexposed conductor, whose rear surface is not exposed, having arear surface-unexposed side terminal part protruding outward from a sidesurface of the sealing part; an electronic element provided in thesealing part and provided on a front surface of the rear surface-exposedconductor; and a second connector for electrically connecting theelectronic element to the rear surface-unexposed conductor, wherein therear surface-unexposed conductor is positioned on a front surface sidecompared with the rear surface-exposed part, the second connector has asecond connection tip part and a second connection base part, the secondconnection tip part is positioned on a rear surface side compared withthe second connection base part, and a distance H in a thicknessdirection between a rear surface side end part of the second connectionbase part and a rear surface side end part of the second connection tippart is larger than a width W of the second connection tip part of thesecond connector.
 2. (canceled)
 3. The electronic module according toclaim 1, wherein the second connection base part of the second connectorhas a second hole part, and a total value of the distance H in thethickness direction between the rear surface side end part of the secondconnection base part and the rear surface side end part of the secondconnection tip part and a diameter D of the second hole part is largerthan the width W of the second connection tip part of the secondconnector.
 4. The electronic module according to claim 1, wherein thesecond connection base part of the second connector has a second holepart, and the distance H in the thickness direction between the rearsurface side end part of the second connection base part and the rearsurface side end part of the second connection tip part is larger than adiameter D of the second hole part.
 5. The electronic module accordingto claim 1, wherein the second connection base part of the secondconnector has a second hole part, and a diameter D of the second holepart is equal to or larger than the width W of the second connection tippart of the second connector.
 6. The electronic module according toclaim 1, wherein the rear surface-exposed conductor has an internal bentpart bent in the sealing part, and the rear surface-unexposed conductordoes not have an internal bent part.
 7. The electronic module accordingto claim 1, wherein the rear surface-exposed conductor has a connectedpart which is provided between the rear surface-exposed part and therear surface-exposed side terminal part, and whose rear surface is notexposed, and a thickness of the connected part is thinner than athickness of the rear surface-exposed part and a thickness of the rearsurface-exposed side terminal part.
 8. The electronic module accordingto claim 1, further comprising a fastening member insertion partprovided at a peripheral part of the sealing part and configured toinsert a fastening member, wherein the rear surface-exposed conductorhas a peripheral rear surface-exposed conductor and an inner rearsurface-exposed conductor provided at a position farther from thefastening member insertion part than the peripheral rear surface-exposedconductor, and an area of the rear surface-exposed part of theperipheral rear surface-exposed conductor is smaller than an area of therear surface-exposed part of the inner rear surface-exposed conductor.9. The electronic module according to claim 7, wherein a pair offastening member insertion parts is provided, and in comparison with thearea of the rear surface-exposed part of the inner rear surface-exposedconductor, a reduction amount of the rear surface-exposed part of theperipheral rear surface-exposed conductor on one side is larger than areduction amount of the rear surface-exposed part of the peripheral rearsurface-exposed conductor on the other side.